Method of making a floating gate non-volatile mos semiconductor memory device with improved capacitive coupling and device thus obtained

ABSTRACT

A method of making a non-volatile MOS semiconductor memory device includes a formation phase, in a semiconductor material substrate, of isolation regions filled by field oxide and of memory cells separated each other by said isolation regions The memory cells include an electrically active region surmounted by a gate electrode electrically isolated from the semiconductor material substrate by a first dielectric layer; the gate electrode includes a floating gate defined. simultaneously to the active electrically region. A formation phase of said floating gate exhibiting a substantially saddle shape including a concavity is proposed.

PRIORITY CLAIM

This application is a continuation of U.S. application Ser. No.11/317,641, filed Dec. 22, 2005, which claims priority from Europeanpatent application Nos. 04425936.4 and 04425937.2 both filed Dec. 22,2004, all of which are incorporated herein by reference in theirentirety.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is related to U.S. patent application Ser. No. ______entitled METHOD OF MAKING A FLOATING GATE NON-VOLATILE MOS SEMICONDUCTORMEMORY DEVICE WITH IMPROVED CAPACITIVE COUPLING (Attorney Docket No.2110-175-03), which has a common filing date and owner and which isincorporated by reference.

TECHNICAL FIELD

The present invention relates generally to a method of making asemiconductor memory device.

More precisely, the present invention relates to a method of making afloating gate non-volatile MOS memory device.

BACKGROUND

Memories are devices able to store and to make accessible informationstored in binary form as bits, and they can be subdivided in variouscategories according to the storage capacity and to the time necessaryto retrieve the information stored therein.

Semiconductor memories are made in MOS (metal-oxide-semiconductor)technology on a semiconductor material substrate, typically singlecrystalline silicon, and are called non-volatile when they retain theinformation for considerable times and in absence of power supply.

Among non-volatile MOS memories, a particularly important class is thatconstituted by floating gate devices, in which the single cell isconstituted by a MOSFET (metal-oxide-semiconductor field effecttransistor) in which the gate electrode includes an additional electrode(floating gate) placed between the channel and the control electrode(control gate), completely surrounded by electrical insulation andseparated by a dielectric from the control gate.

The information stored in the cell is represented by the charging stateof the gate electrode, that is modified by either injecting electronsfrom the FET into the floating gate (writing) or removing them(erasing).

In absence of relatively high voltages applied to the FET electrodes,the floating gate charge remains almost unaltered in time because theelectrons remain in such electrode without dispersing into thesurrounding environment, thanks to the presence of insulating layersthat surround the floating gate.

Among the floating gate non-volatile MOS memories, a dominant positionis occupied by flash memories, whose main features are given by thepossibility of being written and erased electrically, by random accessnot only for reading but even for writing, and by the considerable highintegration density, due to the presence of a particularly compactsingle transistor elementary cell.

In flash memories, the mechanism adopted for writing, or programming, amemory cell is the injection into the floating gate of “hot” electronscoming from the channel and “heated” by the application of a suitablepotential difference between source and drain.

In a write operation, some ten of thousands of electrons are injectedinto the floating gate, and the retention thereof inside the floatinggate provides the memory non-volatility.

The physical mechanism adopted for erasing a flash memory cell, anoperation in which the floating gate substantially is emptied of theelectrons injected during the writing, is the tunneling through adielectric of the electrons from the floating gate to the source, madepossible by the application of a suitable potential difference betweenthe control gate and the source.

The efficiency of this charge transfer process is measured by thecapacitive coupling between control gate and floating gate, that isexpressed in terms of a capacitive coupling coefficient α_(G), definedas the ratio between the capacitance C_(CG) of the control gate and thetotal capacitance C_(TOT) associated with the gate electrode, that alsotakes into account the capacitive couplings due to the presence of thesource C_(s), of the drain C_(D), of the tunnel oxide and of the channelC_(FG):

60 G=C _(CG) /C _(TOT) =C _(CG)/(C _(CG) +C _(FG) +C _(S) +C _(D)).

According to a model widely in use, the sequence of controlgate/dielectric/floating gate layers can be represented as a capacitorwith plane and parallel plates separated by a dielectric, the floatinggate and the control gate being the two plates thereof.

The capacitive coupling coefficient α_(G) is thus proportional to thecapacitance C_(CG)=∈_(diel) (A_(FG)/T_(diel)) where ∈_(diel) is thedielectric constant of the dielectric, A_(FG) is the area of thefloating gate surface facing the control gate, and T_(diel) is thedielectric thickness.

Consequently, the capacitive coupling coefficient α_(G) strongly dependson the shape and the size of the floating gate and, in particular, it isproportional to the floating gate surface area facing the control gate.

In FIGS. 1 and 2 there are shown, in simplified way, respectively across section and a circuit scheme of a portion of a matrix 200 of flashmemory cells, such cross section being taken along a direction AA′ andalong a direction BB′ perpendicular thereto.

FIG. 1 evidences the layered structure of the gate electrode region 4,the wells of the source region 1 and drain region 2, and the centralelectrically active region 10, formed by the FET channel within asilicon single crystalline substrate 3.

Over the FET channel 10 the gate-electrode region 4 is constituted by:

-   -   a first thin dielectric layer 5, typically silicon oxide, called        tunnel oxide;    -   the floating gate 6, usually formed by a heavily doped        polycrystalline silicon layer;    -   a second dielectric layer 7, made for example of a succession of        SiO₂/Si₃N₄/SiO₂ thin layers called ONO (acronym for        oxide-nitride-oxide), that covers the floating gate 6;    -   the control gate 8, typically formed by a heavily doped        polycrystalline silicon layer.        Along the direction BB′, the memory cells 100 are separated by        insulating regions 9, that in the currently more advanced        technologies are of STI (shallow trench isolation) type, i.e.,        they are constituted by trenches in the single crystalline        silicon substrate 3, filled up by one or more dielectric layers.

Typically, the memory cells 100 are organized in a matrix structure,that, as shown by way of example in FIG. 2 for a NOR matrix 200 of flashtype memory cells 100, is arranged in rows 21, called word lines,running along the direction BB′, and columns 22, called bit lines,running along the direction AA′.

In the matrix 200, the control gates 8 of the memory cells 100 form theword lines 21, and along this direction source connection lines 24,constituted by semiconductor material, extend in regular intervals, forexample every sixteen cells, running parallel to the bit lines 22.

The bit lines 22, which constitutes the drain connection lines, areformed by conductor material, typically a metal or an alloy of one ormore metals (for example Al, AlCu, Cu, W . . . ) and run perpendicularlyto the word lines 21.

In the direction of the bit lines 22, the drains 2 of adjacent memorycells 100 face each other, and in correspondence to each pair of faceddrains 2, drain electric contacts 23 are provided along the bit lines22, connecting the drains 2 to the bit lines 22.

Also the sources 1 of adjacent memory cells 100 face each other in thedirection of the bit lines 22, and the diffusion source lines 26 connectthem to source connection lines 24 by means of source electric contacts25, along the direction of the word lines 21.

A conventional process for fabrication of flash memories calls for theformation of the isolation regions 9, for example of STI type, and ofthe floating gates 6 of the memory cells 100 through the followingphases:

1. On the single crystalline silicon substrate 3, a sufficiently thindielectric layer is grown, of thickness ranging from 10 to 20 nm, calledpad oxide;

2. On the pad oxide, a silicon nitride layer of thickness typicallyranging from 100 nm to 200 nm is deposited, that has the function ofstop layer for the following planarization treatments;

3. The areas where the STI type isolation regions 9 will be made aredefined by lithography;

4. The nitride layer and the pad oxide are removed in sequence fromthese areas, and trenches of the desired depth, typically about 150 nm,are formed inside the single crystalline silicon bulk 3;

5. The trenches are filled with one or more layers of dielectricmaterial, that as a whole are called field oxide;

6. The field oxide is planarized, typically using the CMP (chemicalmechanical polishing) technique, in such a way as its exposed surface isflush with that of the still present nitride portion;

7. The exposed field oxide surface level is lowered, typically by a wetetch in hydrofluoric acid (HF), so that at the end of the process theheight difference between the field oxide surface and the surface of thesingle crystalline silicon substrate 3 is not too high (−20 nm).

After having formed in this way the STI type isolation regions 9, theprocess of formation of the floating gates 6 of the memory cells 100proceeds with the following phases:

8. The portion of nitride still present is removed;

9. A sacrificial dielectric layer called sarox is grown, of thicknessapproximately equal to 10 nm;

10. Through the sarox layer, some phases of dopant implantation areperformed, necessary to the operation of the memory cell 100;

11. The sarox layer and the pad oxide layer are removed by wet etching;

12. The tunnel oxide 5 is grown, of thickness ranging from 5 nm to 10nm;

13. A polycrystalline silicon layer is deposited, of about 100 nmthickness;

14. The polycrystalline silicon layer is defined by lithography andetching, so as to form the floating gate 6 of the memory cell 100;

15. The layer of ONO (oxide-nitride-oxide) 7 is deposited, covering thefloating gate 6;

16. The control gate 8 is formed, typically made of heavily dopedpolycrystalline silicon.

In the last generation technologies, the memory-cell dimensions 100 areso small that to use traditional lithography for the definition of thefloating gate 6, mask alignment is often critical. In fact, a possiblemisalignment, even minimum, in the lithographical definition phase (14above) of the polycrystalline silicon layer, might be too great for suchsmall geometries, and cause the memory cell 100 to be incorrectlydefined.

On the other hand, the quest to reduce the memory dimensions becomesmore and more pressing as the technology progresses, and this demandtranslates into the necessity of devising technological solutions andinnovative integrated structures that allow combining, in such devices,an optimal electric behavior with minimal geometric dimensions.

Therefore, the possibility has been investigated of making a memory cellwith self-aligned insulation, so called because the electrically activeregions and the floating gate are defined simultaneously. The floatinggate is thus automatically aligned to the isolation regions. An exampleof flash memory cell 300 with self-aligned insulation is shown in FIG. 3in schematic transversal section along the direction BB′, not to scaleand limited to the layers of interest. Along the direction AA′, theflash memory cell 300 has a structure similar to the memory cell 100shown in FIG. 1.

In detail, the solution with self-aligned insulation provides forforming isolation regions 9, for example of STI type, and the floatinggates 6A of the memory cells 300 through the following phases:

1A. The tunnel oxide 5 is grown on the single crystalline substrate 3;

2A. A polycrystalline silicon layer, forming the floating gate 6A, ofthickness about of 200 nm is deposited;

3A. A silicon nitride layer of thickness typically ranging from 100 nmto 200 nm, having the function of stop layer for the followingplanarization treatments, is deposited;

4A. The STI type isolation regions are defined by lithography and etchof the sequence of silicon nitride layer, the polycrystalline siliconlayer, the tunnel oxide 5 layer and single crystalline substrate 3, upto formation of trenches of desired depth, typically about of 150 nm,inside the single crystalline silicon substrate 3.

The floating gates 6A thus defined are self-aligned to the type STIisolation regions.

5A. The trenches are filled with the field oxide;

6A. The field oxide is planarized, typically using the CMP (chemicalmechanical polishing) technique, in such a way that the exposed surfacethereof is flush with that of the silicon nitride layer.

7A. The silicon nitride layer is removed by isotropic etching;

8A. The level of the exposed surface of the field oxide is lowered,typically by wet etching in hydrofluoric acid (HF), in such a way touncover the side walls of the floating gate 6A.

9A. The ONO (oxide-nitride-oxide) layer 7, covering the floating gate 6,is deposited;

10A. The control gate 8, typically made of heavily doped polycrystallinesilicon, is formed.

Since in this way the floating gate 6A is self aligned to the STI-typeisolation regions 9, this process flow allows obtaining memory cells 300of reduced dimensions compared to the memory cells 100 made with thetraditional process flow.

Regretfully, for a given thickness of deposited polycrystalline silicon,this last-generation process flow produces floating gates 6A of such amorphology that strongly reduces the capacitive coupling coefficientα_(G) between the floating gate 6A and the control gate 8.

In fact, comparing the morphology of the traditional floating gate 6 ofthe memory cell 100 with that of the floating gate 6A of the memory cell300 with self-aligned insulation as represented in FIG. 4, it can benoticed that the traditional floating gate 6 has some protrusions,so-called “wings”, that extend over the adjacent STI-type isolationregions 9. Such wings are instead missing in the case of the floatinggate 6A of the memory cell 300 with self-aligned insulation.

The lack of these “wings”, due to the complexity of the process phasesthat are used for the realization of the floating gate 6A, causes thewidth W2 of the floating gate 6A to be smaller than the width W1 of thetraditional floating gate 6.

Besides, the effective thickness T2 of the floating gate 6A is alsolower than that of the traditional floating gate 6, indicated with T1.

This difference is due to the fact that in the process flow realizingthe floating gate 6A the lowering step of the level of the exposed fieldoxide surface (step 8A) is performed after the growth phase (step 1A) ofthe tunnel oxide 5. Therefore a margin, on the order of the about tennanometers, is required in the lowering phase (step 8A) of the exposedfield-oxide surface so as to preserve the tunnel oxide 5.

Accordingly, the side walls of the floating gate 6A are partiallycovered by field oxide, and therefore the effective thickness T2 of thefloating gate 6A is lower than the effective thickness T1 of thetraditional floating gate 6.

These differences in the geometric dimensions of the floating gate 6 and6A are reflected in the values of the capacitive coupling coefficientsα_(G) of the traditional memory cells 100 and 300 with self-alignedinsulation, whose ratio is expressed by the relationship:

α_(G)(300)/α_(G)(100)÷(W2+2T2)/(W1+2T1)

from which it can be deduced that, W2 and T2 being lower than W1 and T1,the capacitive coupling coefficient α_(G) of the memory cell 300 withself-aligned insulation is lower than the corresponding capacitivecoupling coefficient α_(G) of the traditional memory cell 100.

It has been verified experimentally that this difference can beestimated to be of order of at least 10 percent.

Such an efficiency loss in the capacitive coupling α_(G) leads to anincrease in the erasing time of the memory cell 300 with self-alignedinsulation, since the charge transfer process from the floating gate 6Ato the source region 1 is less efficient, and thus may cause the finalerase voltage to be higher than with the floating gate 6.

The management of high erase voltages is often burdensome and can causephenomena such as degradation of the quality of the active oxides,worsening the characteristics of reliability of the memory cell 300 withself-aligned insulation, the electric performance of which may beaccordingly limited.

The formation of the floating gate 6A starting from a thicker depositedpolycrystalline silicon allows partial recovery of the loss ofcapacitive coupling between floating gate and control gate, but this mayintroduce other problems; in particular, the filling by field oxide ofthe isolation trenches may become difficult because of the increaseddepth of the trench to be filled.

SUMMARY

According to an embodiment of the invention, a method is provided forobtaining a floating gate non-volatile MOS memory device having verysmall geometric dimensions, and in which the memory cells have acapacitive coupling coefficient α_(G) between control gate and floatinggate higher than that obtainable according to the prior art, thusovercoming limitations and drawbacks that still limit the devices ofthis type made according to the prior art.

Another embodiment of the invention concerns a floating gatenon-volatile MOS semiconductor memory cell with self-aligned insulation.

BRIEF DESCRIPTION OF THE DRAWINGS

In FIG. 1 there is shown in schematic transversal section a flash memorycell according to the prior art, along two perpendicular directions AA′and BB′;

In FIG. 2 a circuit diagram of a portion of a typical matrix structureof flash NOR memory cells according to the prior art is shown;

In FIG. 3 a flash memory cell with self-aligned insulation according tothe prior art is shown, in schematic transversal section, along thedirection BB′;

In FIG. 4 there is shown in perspective view a comparison between themorphology of the transversal section of a flash memory cell withself-aligned insulation and that of a traditional memory cell, accordingto the prior art, along the direction BB′;

In FIG. 5 there is shown, in schematic transversal section and limitedto the layers of interest, a non-volatile MOS memory cell with floatinggate with self-aligned insulation according to an embodiment of theinvention, along the direction BB′;

FIGS. 6A-6D show, in transversal section along the direction BB′ and inschematic way, some phases of a method of making a non-volatile MOSmemory device with floating gate with self-aligned insulation, accordingto an embodiment of the invention;

FIGS. 7A-7E show, in transversal section along the direction BB′, and inschematic way, a sequence of phases of a method of making a non-volatileMOS memory device with floating gate with self-aligned insulationaccording to a first embodiment of the invention;

FIGS. 8A-8D show, in transversal section along the direction BB′ and inschematic way, a sequence of phases of a method of making a non-volatileMOS memory device with floating with self-aligned insulation to STI-typeisolation regions according to a second embodiment of the invention.

DETAILED DESCRIPTION

A method of making a non-volatile MOS memory device with floating gatewith self-aligned insulation, according to an embodiment of theinvention will be now described.

Particularly, the case of a flash type non-volatile MOS memory devicewith floating gate with self-aligned insulation is considered by way ofexample.

The example does not constitute a limitation of the present invention,which can also be applied also to different types of non-volatile MOSmemory devices with floating gates that use a self-aligned insulationscheme.

With reference to FIG. 5, an example of flash type memory cell 500inside a non-volatile MOS memory device, obtained according to anembodiment of the invention, is represented in schematic transversalsection, which is limited to the layers of interest along the directionBB′, and which includes an electrically active region 51 inside a singlecrystalline silicon substrate 50, capped by a layer structure thatconstitutes the gate electrode region 52.

The gate electrode region 52 includes:

-   -   a first thin dielectric layer 53, typically silicon oxide,        called tunnel oxide;    -   the floating gate 54, including a first conductor material        layer, for example heavily doped polycrystalline silicon;    -   a second dielectric layer 55, for example constituted by a        SiO₂/Si₃N₄/SiO₂ layers sequence called ONO        (oxide-nitride-oxide), that covers the floating gate 54;    -   the control gate 56, formed by a second conductor material        layer, for example heavily doped polycrystalline silicon.

Along the direction BB′, the direction along which the word linesextend, adjacent memory cells 500 are separated by STI (shallow trenchisolation) type isolation regions 57.

According to an embodiment of the invention, the floating gate 54advantageously takes a concave, generically saddle shape. Particularly,the floating gate 54 includes a base wall 54T and side walls 54L, ofshape and thickness such as to cause the floating gate 54 to exhibit aconcavity facing upward that makes the floating gate take a generically“U” shape. This characteristic of the floating gate 54 provides a gatecapacitive coupling α_(G) of the memory cell 500 that is higher comparedto the prior art, and it favors a reduction of the reading disturbancesassociated with the capacitive couplings between the floating gates 54of adjacent memory cells 500.

Particularly, according to an embodiment of the invention, said sidewalls 54L protrude from said base wall 54T to a height equal to at leastfive times the thickness of said base wall 54T.

The structure just described can be obtained according to an embodimentof the invention by the process flow that is described in the following,that is limited to the description of the process steps of interest, andis not exhaustive of a process flow suitable for obtaining an integratedmemory device according to well known techniques.

With reference to FIGS. 6A-6D, an embodiment of the proposed innovativesolution includes the following process steps for the formation ofmemory cells 500 with self-aligned insulation:

1. The tunnel oxide 53, of thickness ranging, for example, from 5 nm to10 nm, is grown on the single crystalline silicon substrate 50 (FIG.6A);

2. A conductor material layer 54A is deposited, for example heavilydoped polycrystalline silicon, of thickness ranging, for example, from50 nm to 150 nm, such as 100 nm, from which will be obtained thefloating gate 54 of the memory cell 500 (FIG. 6A);

3. A silicon nitride layer 63 of thickness ranging, for example, from100 nm to 200 nm, having the function of stop layer for the followingplanarization treatments, is deposited (FIG. 6A);

4. The insulation regions 57, for example of STI-type, are defined bylithography and etching of the silicon nitride 63, conductor material54A, tunnel oxide 53 and single crystalline substrate 50 layerssequence, up to forming inside the single crystalline substrate 50trenches of desired depth, for example a depth of about of 150 nm (FIG.6B).

The conductor material layer 54A thus defined is self-aligned with thetype STI isolation regions 57.

5. The trenches are filled with one or more layers of dielectricmaterial, that form the field oxide 65 (FIG. 6C);

6. The field oxide 65 is planarized, using for example the CMP (chemicalmechanical polishing) technique, so that its exposed surface is flushwith that of the still present silicon nitride portion 63 (FIG. 6C).

After having formed in this way the STI isolation regions 57, theprocess of formation of the floating gates 54 self-aligned to the STIisolation regions 57 proceeds with the following steps:

7. The portion of silicon nitride 63 still present is removed (FIG. 6D);

After the removal step (step 7) of the portion of the still presentsilicon nitride layer 63, a first embodiment of a method according tothe invention proposes advantageously the following process steps, shownin FIGS. 7A-7E:

8. A dielectric layer 66, for example silicon oxide or silicon nitrideof thickness such as to be conformal, and thus that is substantiallyfollowing the profiles of the underlying layers, is deposited. Thethickness of the dielectric layer 66 ranges, for example, from 5 nm to15 nm (FIG. 7A);

9. The dielectric layer 66 just deposited is anisotropically etched,through an etch composition that is selective with respect to theconductor material of the layer 54A. If for example the layer 54Aincludes heavily doped polycrystalline silicon, etch compositions can beused that are based on oxygen and fluorine carbides as C₄F₆, CF₄, C₄F₈.In such a way, dielectric “spacers” 67 are defined above the conductormaterial layer 54A, at the sides of the field oxide 65 (FIG. 7B);

10. Exploiting the presence of the just defined dielectric “spacers” 67,the level of the conductor material layer 54A is lowered through ananisotropic etch that is selective with respect to the dielectric ofwhich the “spacers” 67 are constituted. Such etch for example uses anetch composition based on oxygen and chlorine or based on oxygen andbromidic acid. The formation of the floating gate 54 is thus completed;the floating gate takes the concave saddle shape defined above, withbase wall 54T and side walls 54L (FIG. 7C). Advantageously, in such away it is the thickness of a deposited layer (side walls 67), and not alithography operation, that defines the thickness of the side walls 54L.Therefore, very thin side walls 54L can be obtained, for example, ofabout 30 nm or even less.

11. The dielectric “spacers” 67 are removed through an isotropic etchthat is selective with respect to the conductor material of which thefloating gate 54 is formed, for example heavily doped polycrystallinesilicon. In the case of removal of silicon oxide, an etch inhydrofluoric acid (HF) is for example used, and in the case of removalof silicon nitride, an etch in phosphoric acid is, for example, used(FIG. 7D);

12. The level of the field oxide 65 exposed surface is lowered through awet etching, for example in hydrofluoric acid (HF), set in such a way touncover the side walls 54L of the floating gate 54 (FIG. 7D). If thematerial of which the “spacers” 67 are formed is the same as the fieldoxide 65, the wet etching performed in this phase advantageouslyincludes also the removal of the “spacers” 67 as indicated above in step11;

13. The dielectric layer 55 is deposited, for example ONO(oxide-nitrideoxide), covering the floating gate 54 (FIG. 7E);

14. The control gate 56 is formed, for example made of heavily dopedpolycrystalline silicon (FIG. 7E).

The process continues according to a traditional scheme, with thedefinition of the gate electrode through anisotropic etching of thecontrol gate 56, dielectric 55 and floating gate 54 layers sequence,followed by a known sequence of operations that lead to the realizationof the finished memory device.

In alternative to the sequence of process phases just described, asecond embodiment of a method according to the invention proposes, inthe deposition phase (step 2) of the layer 54A, the deposition of alower thickness of conductor material, for example, ranging from 30 nmto 40 nm. Also, the second embodiment proposes, after the removal phase(step 7) of the layer of silicon nitride 63, the following processsteps, shown in schematic way in FIGS. 8A-8D:

8A. A conformal conductor material layer 54B is deposited, in such a wayto substantially follow the profile of the underlying layers. Theconformal layer 54B is, for example, of the same material as the layer54A deposited before, for example heavily doped polycrystalline silicon.The conformal layer 54B of conductor material has a thickness ranging,for example, from 5 nm to 15 nm, and is short-circuited with the layer54A of conductor material previously deposited, that forms the base wall54T of the floating gate 54 (FIG. 8A);

9A. The conformal layer 54B just deposited is etched through ananisotropic selective etch with respect to the field oxide 65, touncover the surface of the field oxide 65, in such a way as to form theside walls 54L′ of the floating gate 54 (FIG. 8B).

The floating gate 54 thus formed takes the concave saddle shape definedabove, with base wall 54T formed by the remaining portion of theconductor material layer 54A and side walls 54L′ formed by the remainingportions of the conformal layer 54B. Advantageously, in this way thethickness of a deposited layer (the layer 54D), and not a lithographyoperation, defines the thickness of the side walls 54L′. Therefore, verythin side walls 54L′ can be obtained, for example, of about 30 nm oreven less.

13A. The level of the exposed field oxide surface 65 is lowered, by awet etching, for example in hydrofluoric acid (HF), in such a way touncover the side walls 54L of the floating gate 54 (FIG. 8C);

14A. The dielectric layer 55 is deposited, for example ONO(oxide-nitrideoxide), covering the floating gate 54 (FIG. 8D);

15A. The control gate 56 is formed, made for example of heavily dopedpolycrystalline silicon (FIG. 8D).

The process proceeds according to a traditional scheme, with thedefinition of the gate electrode by anisotropic etch of the control gate56, dielectric 55 and the floating gate 54 layers sequence, followed bya sequence of known operations that lead to the fabrication the finishedmemory device.

By the method just described, an embodiment of the invention makes afloating gate non-volatile semiconductor memory device of very reducedgeometric dimensions, typical of memory devices with self-alignedinsulation, in which nevertheless the memory cells advantageouslypossess a capacitive coupling coefficient α_(G) higher than thatobtainable according to the prior art, overcoming limitations anddrawbacks that limit the known devices of this type.

In fact, thanks particularly to the floating-gate shape, the portion ofthe floating-gate surface that faces the control gate is greater thanthat obtainable according the prior art.

Accordingly, the capacitive coupling coefficient α_(G) being directlyproportional to the area of the floating gate surface facing the controlgate, its value is greater than that obtainable by known methods.

Such a higher value of the capacitive coupling coefficient α_(G)significantly improves the efficiency of the programming and erasingoperations of the memory cells, thus overcoming problems present inmemory devices made according to the prior art.

Advantageously, the, above-described embodiments allow obtaining ahigher value of the capacitive coupling coefficient α_(G) without theaddition of lithographic phases, that can produce misalignments anddimensional problems.

In addition, the above-described embodiments allow making a floatinggate non-volatile semiconductor memory device in which the parasiticcapacitive coupling between adjacent memory cells is advantageouslyreduced with respect to that obtainable according to the prior art.

This advantage is due to the fact that the obtained floating gate,thanks to the peculiar concave saddle shape, possesses side walls oflower area than the devices made according to the prior art.

In fact, based on the model of a capacitor with plane and parallelplates, the parasitic capacitive coupling between adjacent memory cells,particularly in the direction AA r along which the bit lines extend, isdirectly proportional to the area of the walls of the floating gates ofadjacent cells facing each other.

Since it is advantageously the thickness of a deposited layer, and not alithography operation, that defines the thickness of the side walls ofthe floating gate, the above-described embodiments allow making the sidewalls of floating gates of adjacent memory cells of very reducedthickness, if desired thinner than the base wall, thereby allowing theformation of adjacent memory cells with reduced parasitic capacitivecoupling.

This peculiarity is particularly advantageous in the case of NANDflash-type floating gate non-volatile semiconductor memory devices, inwhich the disturbances due to the parasitic capacitive coupling betweenadjacent memory cells currently represent one of the causes of variationof the threshold voltage in the memory cell matrixes.

Also, it is particularly useful applying the above-described embodimentsto multilevel flash memories, in which the reduced threshold variationmargins between the different programming states make the correctoperation of the memory cells particularly critical in the presence of ahigh parasitic capacitive coupling between adjacent memory cells.

The above-described embodiments are therefore very advantageous in thecase of NOR or NAND flash type or multilevel floating gate non-volatilesemiconductor memory devices, but they can be applied to anysemiconductor memory device in which it is desired to have a widecoupling area between the floating gate and any other electrode.

Memory cells formed according to the above-described embodiments may beincluded in an integrated circuit (IC) such as a memory IC, which may beincluded in an electronic system such as a computer system.

From the foregoing it will be appreciated that, although specificembodiments of the invention have been described herein for purposes ofillustration, various modifications may be made without deviating fromthe spirit and scope of the invention.

1. A method of making a non-volatile memory device, the methodcomprising: forming, in a semiconductor material substrate, isolationregions filled with field oxide and memory cells separated one from theother by said isolation regions, at least one of the memory cellsincluding an electrically active region surmounted by a gate electrodeelectrically insulated from said semiconductor material substrate by afirst dielectric layer, the gate electrode including a floating gate;and forming the floating gate to exhibit a substantially saddle-shapedconcavity.
 2. The method according to claim 1, wherein forming thefloating gate comprises: forming a base wall and of side walls belongingto the floating gate, said side walls protruding from said base wall inproximity of the isolation regions.
 3. The method according to claim 2,wherein forming the floating gate comprises: a first deposition phase ofa first conductor material layer; a phase of simultaneous definition ofsaid first conductor material layer and of said isolation regions, andsubsequent filling of said isolation regions with said field oxide; anda second deposition phase of a conformal material layer above said firstconductor material layer and said isolation regions.
 4. The methodaccording to claim 3, wherein said second deposition phase comprises:the deposition of a second dielectric layer.
 5. The method according toclaim 4, further comprising: after said deposition of said seconddielectric layer, the following phases: a definition phase of spacers ofsaid second dielectric layer above said first conductor material layer,through a first anisotropic etch of said second dielectric layer; alowering phase of said first conductor material layer, through a secondanisotropic etch of said first conductor material layer, to shape saidfloating gate; and a removal phase of said spacers, through a firstisotropic etch.
 6. The method according to claim 4, wherein said seconddielectric layer has a thickness ranging from about 5 nm to about 15 nm.7. The method according to claim 4, wherein said second dielectric layerincludes silicon oxide or silicon nitride.
 8. The method according toclaim 5, wherein said first anisotropic etch and said first isotropicetch comprise: using an etch-selective composition with respect to saidfirst conductor material layer.
 9. The method according to claim 5,wherein said second anisotropic etch comprises: using an etch-selectivecomposition with respect to said second dielectric layer.
 10. The methodaccording to claim 3, wherein said second deposition phase comprises:the deposition of a second conductor material layer.
 11. The methodaccording to claim 10, further comprising: an anisotropic etch phase ofsaid second conductor material layer and of said first conductormaterial layer, to shape the floating gate.
 12. The method according toclaim 10, wherein said second conductor material layer comprises: thesame conductor material as said first conductor material layer.
 13. Themethod according to claim 10, wherein said second conductor materiallayer comprises: doped or non doped polycrystalline silicon.
 14. Themethod according to claim 10, wherein said second conductor materiallayer has a thickness ranging from about 5 nm to about 15 nm.
 15. Themethod according to claim 11, wherein said anisotropic etch comprises:using an etch-selective composition with respect to said field oxide.16. The method according to claim 5, further comprising: after saidformation phase of said floating gate, the following phases: a loweringphase of the exposed surface of said isolation regions, to uncover atleast some of said side walls of said floating gate; and a formationphase of a control gate electrically insulated from said floating gatethrough a third dielectric layer.
 17. The method according to claim 16,wherein said lowering phase comprises: a wet etching, using hydrofluoricacid.
 18. The method according to claim 3, wherein said first conductormaterial layer has a thickness ranging from about 30 nm to about 150 nm.19. The method according to claim 10, wherein said first conductormaterial layer has a thickness ranging from about 30 nm to about 40 nm.20. The method according to claim 3, wherein said first conductormaterial layer includes doped or non doped polycrystalline silicon. 21.The method according to claim 1, wherein said isolation regions compriseshallow trench isolation regions.
 22. The method according to claim 1,wherein said floating gate is simultaneously defined with saidelectrically active region.